The root of process yield begins with clean, high-quality raw materials. Ensuring compliance with standards and quality expectations depends on both the procurement team and material suppliers, who must guarantee not only quantity but also reliability and purity. Whether dealing with acidic, alkaline, colloidal, or mixed liquid materials, let Elixir Microtest support you in monitoring quality right from the source.
As AI continues to advance, chip miniaturization and ESG considerations push the boundaries of modern manufacturing. High-efficiency, low-emission, low-loss, and ultra-pure process designs — along with resilient, sustainable material alternatives — challenge today’s R&D labs to innovate. Elixir Microtest supports you in upgrading from the breakthrough point toward a better future.
High-quality R&D design and premium raw materials must be matched with equipment that maintains optimal cleanliness at all times. For process and reaction chemical tanks, data-driven monitoring based on meaningful environmental parameters offers deeper insights and more effective control than experience-based judgment alone.
In semiconductor and electronics manufacturing, various types of wet processes are involved. Elixir Microtest supports yield monitoring and process quality management through particle count, type, and characteristics—enabling better control over material input, waste, and replacement.
Grinding Process (CMP): Focuses on surface flatness and particle contamination control to ensure a smooth, damage-free surface and prevent defects in subsequent steps.
Electroplating / Electroless Plating: Prioritizes coating uniformity and chemical purity to maintain consistent thickness and avoid contaminants that may affect conductivity or further processing.
Washing Process: Emphasizes removal of chemical residues and particles to ensure cleanliness and prevent downstream contamination.
Etching Process: Focuses on etch rate and selectivity, ensuring precision without over-etching or damaging critical layers, preserving structural integrity.
Stripping Process: Aims for efficient removal of layers like photoresist without damaging the substrate, preparing the surface for the next steps.
