Applications

Demand

CHEMICAL MECHANICAL POLISHING SLURRY

slurry paticle size and composition analysis; partivle aggregation and dispersibility analysis, solving the problem in monitoring manufacturing process defects.

METAL PLATING

In PCB manufacturing process,precipitation of heavy metal particles in degraded electroplating liquid causes abnormal end product . therefore , in-situ monitoring analysis is required.

PAINT & COATING MATERIAL

Analysis of the actual particle distribution in the paint or coating suspension

SOLDER PASTE, THERMAL GREASE AND PACKAGING SILVER GLUE

Liquid manufacturing process analysis , exclude abnormality in the related pastes and silver glue in product manufacturing process.

SEMI note

Advance manufacture wet process inspection

In-situ observation of wet process

  • Pollutant Identification
  • Particle size/Particle size distribution
  • Dispersion/Aggregation

  • Composition
  • Shape
  • Concentration


What FlowVIEW can Do during Electronics/SEMI Manufacturing Process

CMP Slurry
Resin mixed with Fillers
Metal palladium particles in Poor quality plating solution